Best of Both Worlds: Integration of Split Manufacturing and Camouflaging into a Security-Driven CAD Flow for 3D ICs

11/16/2018
by   Satwik Patnaik, et al.
0

With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the intellectual property (IP) of ICs from malicious entities during and after manufacturing (i.e., from untrusted foundries and reverse-engineering by end-users). In this paper, we strive for "the best of both worlds," that is of SM and LC. To do so, we extend both techniques towards 3D integration, an up-and-coming design and manufacturing paradigm based on stacking and interconnecting of multiple chips/dies/tiers. Initially, we review prior art and their limitations. We also put forward a novel, practical threat model of IP piracy which is in line with the business models of present-day design houses. Next, we discuss how 3D integration is a naturally strong match to combine SM and LC. We propose a security-driven CAD and manufacturing flow for face-to-face (F2F) 3D ICs, along with obfuscation of interconnects. Based on this CAD flow, we conduct comprehensive experiments on DRC-clean layouts. Strengthened by an extensive security analysis (also based on a novel attack to recover obfuscated F2F interconnects), we argue that entering the next, third dimension is eminent for effective and efficient IP protection.

READ FULL TEXT

page 5

page 6

research
08/11/2019

A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects

Split manufacturing (SM) and layout camouflaging (LC) are two promising ...
research
02/14/2019

Protect Your Chip Design Intellectual Property: An Overview

The increasing cost of integrated circuit (IC) fabrication has driven mo...
research
06/08/2020

A Survey on Split Manufacturing: Attacks, Defenses, and Challenges

In today's integrated circuit (IC) ecosystem, owning a trusted foundry i...
research
06/03/2018

Concerted Wire Lifting: Enabling Secure and Cost-Effective Split Manufacturing

Here we advance the protection of split manufacturing (SM)-based layouts...
research
11/14/2017

Obfuscating the Interconnects: Low-Cost and Resilient Full-Chip Layout Camouflaging

Layout camouflaging (LC) is a promising technique to protect chip design...
research
06/15/2019

Designing, 3D Printing of a Quadruped Robot and Choice of Materials for Fabrication

Purpose-This paper is based on design of a quadruped robot and manufactu...
research
06/24/2018

Raise Your Game for Split Manufacturing: Restoring the True Functionality Through BEOL

Split manufacturing (SM) seeks to protect against piracy of intellectual...

Please sign up or login with your details

Forgot password? Click here to reset