Semi-Siamese Network for Robust Change Detection Across Different Domains with Applications to 3D Printing
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Automatic defect detection for 3D printing processes, which shares many characteristics with change detection problems, is a vital step for quality control of 3D printed products. However, there are some critical challenges in the current state of practice. First, existing methods for computer vision-based process monitoring typically work well only under specific camera viewpoints and lighting situations, requiring expensive pre-processing, alignment, and camera setups. Second, many defect detection techniques are specific to pre-defined defect patterns and/or print schematics. In this work, we approach the automatic defect detection problem differently using a novel Semi-Siamese deep learning model that directly compares a reference schematic of the desired print and a camera image of the achieved print. The model then solves an image segmentation problem, identifying the locations of defects with respect to the reference frame. Unlike most change detection problems, our model is specially developed to handle images coming from different domains and is robust against perturbations in the imaging setup such as camera angle and illumination. Defect localization predictions were made in 2.75 seconds per layer using a standard MacBookPro, which is comparable to the typical tens of seconds or less for printing a single layer on an inkjet-based 3D printer, while achieving an F1-score of more than 0.9.
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