PCB-Fire: Automated Classification and Fault Detection in PCB

02/22/2021
by   Tejas Khare, et al.
12

Printed Circuit Boards are the foundation for the functioning of any electronic device, and therefore are an essential component for various industries such as automobile, communication, computation, etc. However, one of the challenges faced by the PCB manufacturers in the process of manufacturing of the PCBs is the faulty placement of its components including missing components. In the present scenario the infrastructure required to ensure adequate quality of the PCB requires a lot of time and effort. The authors present a novel solution for detecting missing components and classifying them in a resourceful manner. The presented algorithm focuses on pixel theory and object detection, which has been used in combination to optimize the results from the given dataset.

READ FULL TEXT

page 1

page 2

page 3

page 4

page 5

research
09/13/2021

ChangeChip: A Reference-Based Unsupervised Change Detection for PCB Defect Detection

The usage of electronic devices increases, and becomes predominant in mo...
research
06/22/2021

Hand-Drawn Electrical Circuit Recognition using Object Detection and Node Recognition

With the recent developments in neural networks, there has been a resurg...
research
01/27/2020

Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology

Surface mount technology (SMT) is an enhanced method in electronic packa...
research
07/30/2021

Bayesian Nonparametric Classification for Incomplete Data With a High Missing Rate: an Application to Semiconductor Manufacturing Data

During the semiconductor manufacturing process, predicting the yield of ...
research
04/17/2023

Leveraging Multi-view Data for Improved Detection Performance: An Industrial Use Case

Printed circuit boards (PCBs) are essential components of electronic dev...
research
08/25/2022

Anytime-Lidar: Deadline-aware 3D Object Detection

In this work, we present a novel scheduling framework enabling anytime p...
research
05/31/2015

Manufacturing Pathway and Experimental Demonstration for Nanoscale Fine-Grained 3-D Integrated Circuit Fabric

At sub-20nm technologies CMOS scaling faces severe challenges primarily ...

Please sign up or login with your details

Forgot password? Click here to reset