HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement

11/25/2022

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by   Patrick Iff, et al.

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2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets grows to tens or hundreds, it becomes infeasible to hand-optimize their arrangement in a way that maximizes the ICI performance. In this paper, we propose HexaMesh, an arrangement of chiplets that outperforms a grid arrangement both in theory (network diameter reduced by 42 bandwidth improved by 130 improved by 34 high-performance ICIs.