Formation of Embedded Microstructures by Thermal Activated Solvent Bonding

02/21/2008
by   S. H. Ng, et al.
0

We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30 degrees C lower than the material's Tg), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least 6 bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of polymer and solvent.

READ FULL TEXT
POST COMMENT

Comments

There are no comments yet.

Authors

page 3

page 4

04/21/2021

Machine-Learning Assisted Optimization Strategies for Phase Change Materials Embedded within Electronic Packages

Leveraging the latent heat of phase change materials (PCMs) can reduce t...
07/02/2020

DATE: Defense Against TEmperature Side-Channel Attacks in DVFS Enabled MPSoCs

Given the constant rise in utilizing embedded devices in daily life, sid...
10/13/2020

Impact of Thermal Throttling on Long-Term Visual Inference in a CPU-based Edge Device

Many application scenarios of edge visual inference, e.g., robotics or e...
04/09/2021

Tensor Network for Supervised Learning at Finite Temperature

The large variation of datasets is a huge barrier for image classificati...
06/01/2021

Robust design optimisation of continuous flow polymerase chain reaction thermal flow systems

This paper presents an efficient methodology for the robust optimisation...
03/19/2020

Report on power, thermal and reliability prediction for 3D Networks-on-Chip

By combining Three Dimensional Integrated Circuits with the Network-on-C...
11/21/2007

Process Issues for a Multi-Layer Microelectrofluidic Platform

We report on the development of some process capabilities for a polymer-...
This week in AI

Get the week's most popular data science and artificial intelligence research sent straight to your inbox every Saturday.