Chiplet Actuary: A Quantitative Cost Model and Multi-Chiplet Architecture Exploration

03/23/2022
by   Yinxiao Feng, et al.
0

Multi-chip integration is widely recognized as the extension of Moore's Law. Cost-saving is a frequently mentioned advantage, but previous works rarely present quantitative demonstrations on the cost superiority of multi-chip integration over monolithic SoC. In this paper, we build a quantitative cost model and put forward an analytical method for multi-chip systems based on three typical multi-chip integration technologies to analyze the cost benefits from yield improvement, chiplet and package reuse, and heterogeneity. We re-examine the actual cost of multi-chip systems from various perspectives and show how to reduce the total cost of the VLSI system through appropriate multi-chiplet architecture.

READ FULL TEXT

page 1

page 2

page 3

page 4

page 5

page 6

research
07/10/2020

Design Space Exploration of Power Delivery For Advanced Packaging Technologies

In this paper, a design space exploration of power delivery networks is ...
research
01/23/2023

Security of Electrical, Optical and Wireless On-Chip Interconnects: A Survey

The advancement of manufacturing technologies has enabled the integratio...
research
06/15/2022

Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies

The chiplet-based System-in-Package (SiP) technology enables more design...
research
09/17/2018

The Impact of On-chip Communication on Memory Technologies for Neuromorphic Systems

Emergent nanoscale non-volatile memory technologies with high integratio...
research
06/12/2019

Data Conversion in Area-Constrained Applications: the Wireless Network-on-Chip Case

Network-on-Chip (NoC) is currently the paradigm of choice to interconnec...
research
10/01/2021

Enhanced Multigradient Dilution Preparation

Abstract: In our paper the new algorithm enhanced multi gradient Dilutio...
research
03/21/2020

Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems

Three-Dimensional Networks-on-Chips (3D-NoCs) have been proposed as an a...

Please sign up or login with your details

Forgot password? Click here to reset